07. February 2017 | Nonwovens & Technical Textiles
Intelligent bonding of textile structures
The one and a half day Open Innovation Workshop not only leads through the world of bonding technical textiles and apparel, but also combines the latest and future-oriented aspects of intelligent bonding methods across all industrial sectors. Lohmann's new application laboratory, the so-called "Bonding Arena" provides the setting for this special event. It is part of a discovery tour through the technology center (TEC-Center), completed in October, at the company headquarters in Neuwied. For the first time, Lohmann's technical functions were combined under one roof in the TEC Center in order to demonstrate the activities of the adhesive experts in a variety of ways. This includes Reasearch & Development with the new Product Design Lab, the Application Design Lab (Bonding Arena), Process Technology and the Central Testing Services.
The different areas of the TEC Center will also play a role in the Open Innovation Workshop. Creative idea development and interdisciplinary inspiration outside the daily routine are the aim of the event. Supported by experts from the ITA (Institute for Textile Technology, RWTH Aachen University / ITA Technologietransfer GmbH), and professionally moderated by the P3 Group (www.p3-group.com), the focus is placed on an open, non-committal exchange of ideas in an extraordinary environment. The participants should be provided with a platform to exchange ideas and technologies and to generate projects.
The joint dialogue will also have special emphasis at the forthcoming Techtextil (May 9-12, 2017). Here, Lohmann's "Bonding Engineers" will present their innovative solutions for technical textiles. Under the motto "Connecting the Future", in 2017 the subject of innovation is clearly the focus of the exhibition. Reason enough for Lohmann to organize an Open Innovation Workshop beforehand.
Interested in the Open Innovation Workshop? Then simply send an email with your contact details to SBF@lohmann-tapes.com